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Patent Information
Title
半導体装置及びその製造方法
Author
Takayuki Ohba
.
Kind
Patent
Status
Published
Applicant
国立大学法人東京科学大学.
Filing Date
2024/08/28
Application Number
特願2024-146863
Unexamined Application Date
2026/03/12
Publication Number
特開2026-043503
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