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Title
Japanese:半導体封止樹脂の切欠き部強度評価に関する検討 
English: 
Author
Japanese: 川村法靖, 川上崇, 岸本喜久雄.  
English: 川村法靖, 川上崇, 岸本喜久雄.  
Language Japanese 
Journal/Book name
Japanese:日本機械学会材料力学部門講演会講演論文集 
English: 
Volume, Number, Page Vol. 99    No. 16    pp. 89-90
Published date 1999 
Publisher
Japanese: 
English: 
Conference name
Japanese: 
English: 
Conference site
Japanese: 
English: 

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