Mechanical Fatigue Tests of Solder Bumps

Publication Information

Title

Japanese:
English:	Mechanical Fatigue Tests of Solder Bumps

Author

Japanese:	Minoru Mukai, Hiroyuki Takahashi, Takashi Kawakami, Kuniaki Takahashi, Ken Iwasaki, Kikuo Kishimoto.
English:	Minoru Mukai, Hiroyuki Takahashi, Takashi Kawakami, Kuniaki Takahashi, Ken Iwasaki, Kikuo Kishimoto.

Language

English

Journal/Book name

Japanese:
English:	Advances in Electronic Packaging, EEP

Volume, Number, Page

Vol. 26 No. 1 pp. 449-455

Published date

1999

Publisher

Japanese:
English:

Conference name

Japanese:
English:

Conference site

Japanese:
English: