Thermal Fatigue Life of Solder Bumps in BGA

Publication Information

Title

Japanese:
English:	Thermal Fatigue Life of Solder Bumps in BGA

Author

Japanese:	Minoru Mukai, Takashi, Kawakami, Kuniaki Takahashi, Kikuo Kishimoto, Toshikazu Shibuya.
English:	Minoru Mukai, Takashi, Kawakami, Kuniaki Takahashi, Kikuo Kishimoto, Toshikazu Shibuya.

Language

English

Journal/Book name

Japanese:
English:	JSME International Journal Ser.A

Volume, Number, Page

Vol. 41 No. 2 pp. 260-266

Published date

1998

Publisher

Japanese:
English:

Conference name

Japanese:
English:

Conference site

Japanese:
English:

DOI