Optimization of Electroplating on Silicon Wafer | Tokyo Tech Research Repository (T2R2)

Publication Information

Title

Japanese:	シリコンウェハへの電気めっきの最適化
English:	Optimization of Electroplating on Silicon Wafer

Author

Japanese:	阿部馨督, 青木繁, 天谷賢治, 宮坂松甫.
English:	阿部馨督, 青木繁, 天谷賢治, 宮坂松甫.

Language

Japanese

Journal/Book name

Japanese:	日本機械学会第13回計算力学講演会講演論文集No.00-17
English:

Volume, Number, Page

pp. 315-316

Published date

2000

Publisher

Japanese:
English:

Conference name

Japanese:
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Conference site

Japanese:
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