DEVELOPMENT OF MECHANIAL SYSTEMS FOR MICRO-BONDING BY ADHESIVE: PROPOSAL OF MICRO APPLICATION TECHNOLOGY OF ADHESIVE RESIN

Publication Information

Title

Japanese:
English:	DEVELOPMENT OF MECHANIAL SYSTEMS FOR MICRO-BONDING BY ADHESIVE: PROPOSAL OF MICRO APPLICATION TECHNOLOGY OF ADHESIVE RESIN

Author

Japanese:	Mikio HORIE, Kozo IKEGAMI, Futoshi KOBAYASHI.
English:	Mikio HORIE, Kozo IKEGAMI, Futoshi KOBAYASHI.

Language

English

Journal/Book name

Japanese:
English:	The American Society of MEchanical Engineers,AMD-Vol.195,Mechanics and Materials for Electronic Packaging

Volume, Number, Page

Vol. 195 pp. 23-28

Published date

1994

Publisher

Japanese:
English:

Conference name

Japanese:
English:

Conference site

Japanese:
English: