逆解析を利用したシリコンウェハのめっき膜厚のモニタリング

Publication Information

Title

Japanese:	逆解析を利用したシリコンウェハのめっき膜厚のモニタリング
English:	Monitoring of electroplating thickness on silicon wafer using inverse analysis

Author

Japanese:	阿部馨督, 天谷賢治, 青木繁.
English:	阿部馨督, 天谷賢治, 青木繁.

Language

Japanese

Journal/Book name

Japanese:	日本機械学会第14回計算力学講演会講演論文集
English:

Volume, Number, Page

No. 01-10 pp. 195-196

Published date

2001

Publisher

Japanese:
English:

Conference name

Japanese:
English:

Conference site

Japanese:
English: