2層BGAパッケージにおけるメッキ引き出し配線手法

Publication Information

Title

Japanese:	2層BGAパッケージにおけるメッキ引き出し配線手法
English:	Global Routing Method of Plating Lead for 2-Layer BGA Packages

Author

Japanese:	佐藤直, 富岡洋一, 高橋篤司.
English:	Naoki Sato, Yoichi Tomioka, Atsushi Takahashi.

Language

Japanese

Journal/Book name

Japanese:	電子情報通信学会技術研究報告 (VLD2007-154)
English:	IEICE Technical Report (VLD2007-154)

Volume, Number, Page

Vol. 107 No. 507 pp. 61-66

Published date

Mar. 2008

Publisher

Japanese:
English:

Conference name

Japanese:	VLSI設計技術研究会
English:	Technical Committee on VLSI Design Technologies

Conference site

Japanese:	沖縄県
English: