Study of Wafer Direct Bonding for Integration of Optical Isolator with GaInAsP/InP Laser Diode | Tokyo Tech Research Repository (T2R2)

Publication Information

Title

Japanese:
English:	Study of Wafer Direct Bonding for Integration of Optical Isolator with GaInAsP/InP Laser Diode

Author

Japanese:	横井秀樹.
English:	HIDEKI YOKOI.

Type

Type:	Thesis (Ph.D.)
Country:

Language

Organization name

東京工業大学

Report number

Conferred date

2000/--/--

Judge

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