シリコンウェハへの電気めっきの最適化

Publication Information

Title

Japanese:	シリコンウェハへの電気めっきの最適化
English:	Optimization of Electroplating on Silicon Wafer

Author

Japanese:	天谷賢治.
English:	KENJI AMAYA.

Language

Japanese

Journal/Book name

Japanese:	日本機械学會論文集. A編
English:	Transactions of the Japan Society of Mechanical Engineers. A

Volume, Number, Page

Vol. 68 No. 666 pp. 313-318

Published date

2002

Publisher

Japanese:	社団法人日本機械学会
English:	The Japan Society of Mechanical Engineers

Conference name

Japanese:
English:

Conference site

Japanese:	3875008
English:

Official URL

DOI