Evaluation of reliability of film adhesives in semiconductor packages

Publication Information

Title

Japanese:
English:	Evaluation of reliability of film adhesives in semiconductor packages

Author

Japanese:	佐伯尚哉, 因幡和晃, 岸本喜久雄, H. Senoo.
English:	Naoya Saiki, Kazuaki Inaba, Kikuo Kishimoto, H. Senoo.

Language

English

Journal/Book name

Japanese:
English:	Proceedings of Interpack 2011

Volume, Number, Page

Published date

July 13, 2011

Publisher

Japanese:
English:

Conference name

Japanese:
English:	Pacific rim technical conference and exhibition on packaging and integration of electronic and photonic systems (Interpack 2011)

Conference site

Japanese:
English:	Portland, Oregon