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Title
Japanese: 
English:Separation mechanisms of reversible adhesive joining using an elastic body with variable elastic modulus 
Author
Japanese: 関口 悠, HEMTHAVY PASOMPHONE, 齋藤 滋規, 高橋 邦夫.  
English: Y Sekiguchi, P Hemthavy, S Saito, K Takahashi.  
Language English 
Journal/Book name
Japanese: 
English:Journal of Physics: Conference Series 
Volume, Number, Page Volume 379        012041
Published date Aug. 2012 
Publisher
Japanese: 
English: 
Conference name
Japanese: 
English: 
Conference site
Japanese: 
English: 
Official URL http://iopscience.iop.org/1742-6596/379/1/012041
 
DOI https://doi.org/10.1088/1742-6596/379/1/012041
Abstract Reversible adhesive joining that involves altering the elastic modulus of an elastic body is proposed by considering adhesion between a semi-infinite elastic body and a rigid body that has a slightly wavy surface with defects. Separation stress of adhered surfaces is theoretically expressed as a function of the elastic modulus. However, the expression of the separation stress varies depending on the condition of the maximum half contact width of the adhesion area and a parameter that depends on the elastic modulus, the work of adhesion, and the surface roughness. Therefore, separation mechanisms are categorized into six types by considering the maximum half contact width and the above parameter, and theoretically discussed. By utilizing an elastic body which has variable elastic modulus, the separation stress can be controlled and the elastic body can be repeatedly adhered to and separated from an object.

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