High-Strength Electroplated Au-Cu Alloys as Micro-components in MEMS Devices

Publication Information

Title

Japanese:
English:	High-Strength Electroplated Au-Cu Alloys as Micro-components in MEMS Devices

Author

Japanese:	TangHao-Chun, 陳君怡, 葭葉将治, 名越貴志, Chang Tso-Fu Mark, 山根大輔, 町田克之, 益一哉, 曽根正人.
English:	Hao-Chun Tang, Chun-Yi Chen, Masaharu Yoshiba, Takashi Nagoshi, Tso-Fu Mark Chang, Daisuke Yamane, Katsuyuki Machida, Kazuya Masu, Masato Sone.

Language

English

Journal/Book name

Japanese:
English:	Journal of The Electrochemical Society

Volume, Number, Page

Vol. 164 No. 4 pp. D244-D247

Published date

Apr. 1, 2017

Publisher

Japanese:
English:

Conference name

Japanese:
English:

Conference site

Japanese:
English:

DOI