Au-Cu Alloys Prepared by Pulse Electrodeposition toward Applications as Movable Micro-Components in Electronic Devices

Publication Information

Title

Japanese:
English:	Au-Cu Alloys Prepared by Pulse Electrodeposition toward Applications as Movable Micro-Components in Electronic Devices

Author

Japanese:	TangHao-Chun, 陳君怡, Chang Tso-Fu Mark, 名越貴志, 山根大輔, 小西敏文, 町田克之, 益一哉, 曽根正人.
English:	Hao-Chun Tang, Chun-Yi Chen, Tso-Fu Mark Chang, Takashi Nagoshi, Daisuke Yamane, Toshifumi Konishi, Katsuyuki Machida, Kazuya Masu, Masato Sone.

Language

English

Journal/Book name

Japanese:
English:	Journal of The Electrochemical Society

Volume, Number, Page

Vol. 165 No. 2 pp. D58-D63

Published date

Jan. 17, 2018

Publisher

Japanese:
English:

Conference name

Japanese:
English:

Conference site

Japanese:
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