Ultra-high Strength in Electroplated Nanocrystalline Au-Cu Alloys Evaluated by Micro-Compression Tests for MEMS Devices

Publication Information

Title

Japanese:
English:	Ultra-high Strength in Electroplated Nanocrystalline Au-Cu Alloys Evaluated by Micro-Compression Tests for MEMS Devices

Author

Language

English

Journal/Book name

Japanese:
English:	Nano Engineering and Microsystem Technology Conference, Taiwan

Volume, Number, Page

Published date

June 1, 2018

Publisher

Japanese:
English:

Conference name

Japanese:
English:	The 2nd Taiwan-Japan Joint Symposium in Taiwan, by The study group of the Integrated MEMS of JSAP & Nano Engineering and Microsystem Technology Conference, Taiwan

Conference site

Japanese:
English:	Taipei