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Title
Japanese: 
English:Electrodeposited Au-Cu Alloy with High Yield Stress Evaluated by Micro-Bending Test 
Author
Japanese: 浅野 啓介, Tang Hao-Chun, 陳 君怡, 名越 貴志, Chang Tso-Fu Mark, 山根 大輔, 小西 敏文, 町田 克之, 伊藤 浩之, 益 一哉, 曽根 正人.  
English: Keisuke Asano, Hao-chun Tang, Chun-Yi Chen, Takashi Nagoshi, Tso-Fu Mark Chang, Daisuke Yamane, Toshifumi Konishi, Katsuyuki Machida, Hiroyuki Ito, Kazuya Masu, Masato Sone.  
Language English 
Journal/Book name
Japanese: 
English:44rd International Conference on Micro & Nano Engineering (MNE2018) 
Volume, Number, Page        
Published date Sept. 24, 2018 
Publisher
Japanese: 
English: 
Conference name
Japanese: 
English:44rd International Conference on Micro & Nano Engineering (MNE2018) 
Conference site
Japanese:Copenhagen 
English: 

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