High Strength Electrodeposited Gold-Copper Alloys for MEMS Devices

Publication Information

Title

Japanese:
English:	High Strength Electrodeposited Gold-Copper Alloys for MEMS Devices

Author

Japanese:	Tang Hao-Chun, 陳君怡, Chang Tso-Fu Mark, 山根大輔, 小西敏文, 町田克之, 伊藤浩之, 益一哉, 曽根正人, 曽根正人.
English:	Hao-chun Tang, Chun-Yi Chen, Tso-Fu Mark Chang, Takashi Nagoshib, Daisuke Yamane, Toshifumi Konishi, Katsuyuki Machida, Hiroyuki Ito, Kazuya Masu, Masato Sone.

Language

English

Journal/Book name

Japanese:
English:	44rd International Conference on Micro & Nano Engineering (MNE2018)

Volume, Number, Page

Published date

Sept. 24, 2018

Publisher

Japanese:
English:

Conference name

Japanese:
English:	44rd International Conference on Micro & Nano Engineering (MNE2018)

Conference site

Japanese:	Copenhagen
English: