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Title
Japanese: 
English:Electrodeposition of High Strength Au-Cu Alloys for MEMS Device 
Author
Japanese: Chang Tso-Fu Mark, Tang Hao-Chun, 新田 京太朗, 陳 君怡, 名越 貴志, 山根 大輔, 小西 敏文, 町田 克之, 益 一哉, 曽根 正人.  
English: Tso-Fu Mark Chang, Hao-chun Tang, Kyotaro Nitta, Chun-Yi Chen, Takashi Nagoshi, Daisuke Yamane, Toshifumi Konishi, Katsuyuki Machida, Kazuya Masu, Masato Sone.  
Language English 
Journal/Book name
Japanese: 
English:2018 International Conference on Solid State Devices and Materials (SSDM2018) 
Volume, Number, Page        
Published date Sept. 13, 2018 
Publisher
Japanese: 
English: 
Conference name
Japanese: 
English:2018 International Conference on Solid State Devices and Materials (SSDM2018) 
Conference site
Japanese: 
English:Tokyo 

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