Strengthening of Micro-Cantilever by Au/Ti Bi-Layered Structure Evaluated by Micro-Bending Test toward MEMS Devices | Tokyo Tech Research Repository (T2R2)

Publication Information

Title

Japanese:
English:	Strengthening of Micro-Cantilever by Au/Ti Bi-Layered Structure Evaluated by Micro-Bending Test toward MEMS Devices

Author

Language

English

Journal/Book name

Japanese:
English:	Microelectronic Engineering

Volume, Number, Page

Vol. 213 pp. 13-17

Published date

May 15, 2019

Publisher

Japanese:
English:

Conference name

Japanese:
English:

Conference site

Japanese:
English:

DOI

https://doi.org/10.1016/j.mee.2019.04.008

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