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Title
Japanese:半導体ひずみゲージ集積型マイクロツールの設計 
English: 
Author
Japanese: 洞出光洋, 田畑修, 伊藤弘明, 高山俊男, 新井健生, 金子真.  
English: 洞出光洋, 田畑修, 伊藤弘明, Toshio Takayama, 新井健生, 金子真.  
Language Japanese 
Journal/Book name
Japanese: 
English: 
Volume, Number, Page         pp. 2668-2669
Published date Dec. 2017 
Publisher
Japanese: 
English: 
Conference name
Japanese:第18回システムインテグレーション部門講演会 
English: 
Conference site
Japanese: 
English: 

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