Thin Film Optical Characteristics of InP/Si Hybrid Wafers by Chip-on-Wafer Direct Transfer Bonding Technology

Publication Information

Title

Japanese:
English:	Thin Film Optical Characteristics of InP/Si Hybrid Wafers by Chip-on-Wafer Direct Transfer Bonding Technology

Author

Japanese:	西山伸彦, 大平和哉, 白柳, Y. Kurita, H. Furuyama, M. Inamura, 渡邊壮一郎, T. Mitarai, K. Morita, 荒井滋久.
English:	N. Nishiyama, K. Ohira, L. Bai, Y. Kurita, H. Furuyama, M. Inamura, T. Abe, T. Mitarai, K. Morita, S. Arai.

Language

English

Journal/Book name

Japanese:
English:

Volume, Number, Page

p. MoP-D-13

Published date

May 19, 2019

Publisher

Japanese:
English:

Conference name

Japanese:
English:	Compound Semiconductor Week 2019

Conference site

Japanese:
English:	Nara