Nanoscale Analysis of Surface Bending Strain in Film Substrates for Preventing Fracture in Flexible Electronic Devices

Publication Information

Title

Japanese:
English:	Nanoscale Analysis of Surface Bending Strain in Film Substrates for Preventing Fracture in Flexible Electronic Devices

Author

Japanese:	田口諒, 赤松範久, 桑原恒平, 徳光香代子, 小林吉彰, 岸野真之, 八重樫圭太, Jun Takeya, 宍戸厚.
English:	Ryo Taguchi, Norihisa Akamatsu, Kouhei Kuwahara, Kayoko Tokumitsu, Yoshiaki Kobayashi, Masayuki Kishino, Keita Yaegashi, Jun Takeya, Atsushi Shishido.

Language

English

Journal/Book name

Japanese:
English:	Adv. Mater. Interfaces

Volume, Number, Page

Vol. 8 pp. 2001662

Published date

Jan. 25, 2021

Publisher

Japanese:
English:	Wiley

Conference name

Japanese:
English:

Conference site

Japanese:
English: