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Title
Japanese: 
English:Development of a bipolar electrostatic chuck with a compliant beam-array assembly having four 3D-printed layers for large film handling 
Author
Japanese: 田岡祐樹, 林輝道, HEMTHAVYPASOMPHONE, 高橋邦夫, 齋藤滋規.  
English: Yuki Taoka, Terumichi Hayashi, Pasomphone Hemthavy, Kunio Takahashi, Shigeki Saito.  
Language English 
Journal/Book name
Japanese: 
English:Engineering Research Express 
Volume, Number, Page Volume 4    Number 1   
Published date Jan. 21, 2022 
Publisher
Japanese: 
English:IOP Publishing 
Conference name
Japanese: 
English: 
Conference site
Japanese: 
English: 
File
DOI https://doi.org/10.1088/2631-8695/ac4a49

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