Development of a bipolar electrostatic chuck with a compliant beam-array assembly having four 3D-printed layers for large film handling

Publication Information

Title

Japanese:
English:	Development of a bipolar electrostatic chuck with a compliant beam-array assembly having four 3D-printed layers for large film handling

Author

Japanese:	田岡祐樹, 林輝道, HEMTHAVYPASOMPHONE, 高橋邦夫, 齋藤滋規.
English:	Yuki Taoka, Terumichi Hayashi, Pasomphone Hemthavy, Kunio Takahashi, Shigeki Saito.

Language

English

Journal/Book name

Japanese:
English:	Engineering Research Express

Volume, Number, Page

Volume 4 Number 1

Published date

Jan. 21, 2022

Publisher

Japanese:
English:	IOP Publishing

Conference name

Japanese:
English:

Conference site

Japanese:
English:

File

DOI