Electrical Characteristics and Reliability of Wafer-on-Wafer (WOW) Bumpless Through Silicon Via

Publication Information

Title

Japanese:
English:	Electrical Characteristics and Reliability of Wafer-on-Wafer (WOW) Bumpless Through Silicon Via

Author

Japanese:	Yi-Chieh Tsai, LEE Chia-Hsuan, Hsin-Chi Chang, Jui-Han Liu, Han-Wen Hu, 伊藤浩之, YOUNGSUK KIM, 大場隆之, CHEN KUAN-NENG.
English:	Yi-Chieh Tsai, Chia-Hsuan Lee, Hsin-Chi Chang, Jui-Han Liu, Han-Wen Hu, Hiroyuki Ito, Young Suk Kim, Takayuki Ohba, Kuan-Neng Chen.

Language

English

Journal/Book name

Japanese:
English:	IEEE Transactions on Electron Devices

Volume, Number, Page

Vol. 68 No. 7 pp. 3520 - 3525

Published date

July 2021

Publisher

Japanese:
English:

Conference name

Japanese:
English:

Conference site

Japanese:
English:

DOI