A 300-GHz Band Chip-to-Waveguide Transition on Proton-Irradiated Standard 65nm CMOS Si Substrate for Flip-Chip Packaging Implementation

Publication Information

Title

Japanese:
English:	A 300-GHz Band Chip-to-Waveguide Transition on Proton-Irradiated Standard 65nm CMOS Si Substrate for Flip-Chip Packaging Implementation

Author

Japanese:	HERDIAN HANS, Takeshi Inoue, Masatsugu Sogabe, 白根篤史, 岡田健一.
English:	Hans Herdian, Takeshi Inoue, Masatsugu Sogabe, Atsushi Shirane, Kenichi Okada.

Language

English

Journal/Book name

Japanese:
English:

Volume, Number, Page

Published date

June 2022

Publisher

Japanese:
English:

Conference name

Japanese:
English:	IEEE MTT-S International Microwave Symposium (IMS)

Conference site

Japanese:
English:	Denver, CO