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Title
Japanese:有機金属触媒含有液体樹脂からなる3Dプリンター印刷物の無電解 Ni-P めっき 
English:Electroless Ni-P Plating of the 3D Printed Matters from the Liquid Resin Containing Organometallic Catalyst 
Author
Japanese: 高畠 伸典, Cheng Po-wei, Chen Chun-Yi, 栗岡 智行, 曽根 正人, Chang Tso-fu Mark.  
English: Shinsuke Takahata, Po-Wei Cheng, Chun Yi Chen, Tomoyuki Kurioka, Masato Sone, Tso-Fu Mark Chang.  
Language Japanese 
Journal/Book name
Japanese: 
English:Proc. The 71st JSAP Spring MeetinProc. 
Volume, Number, Page         p. 23a-12K-4
Published date Mar. 22, 2024 
Publisher
Japanese: 
English: 
Conference name
Japanese:第71回応用物理学会春季学術講演会 
English:The 71st JSAP Spring Meeting 2024 
Conference site
Japanese: 
English: 

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