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Title
Japanese:Ortho-, Meta-, versus Para-Substituted Mesogens Inducing Higher-Order Structures for Highly Thermal-Conductive Cured Epoxy Resins 
English:Ortho-, Meta-, versus Para-Substituted Mesogens Inducing Higher-Order Structures for Highly Thermal-Conductive Cured Epoxy Resins 
Author
Japanese: 丸井莉花, 前田颯, 畠山歓, Yuta Nabae, 早川晃鏡.  
English: Rika Marui, Hayato Maeda, Kan Hatakeyama, Yuta Nabae, Teruaki Hayakawa.  
Language English 
Journal/Book name
Japanese:Macromolecules 
English:Macromolecules 
Volume, Number, Page Vol. 57    No. 23    pp. 11221-11228
Published date Nov. 2024 
Publisher
Japanese:American Chemical Society 
English:American Chemical Society 
Conference name
Japanese: 
English: 
Conference site
Japanese: 
English: 
Official URL https://doi.org/10.1021/acs.macromol.4c00506
 
DOI https://doi.org/10.1021/acs.macromol.4c00506
Abstract Mesogenic monomers are beneficial, but few studies have investigated the effects of the molecular structure of liquid crystalline epoxy monomers on the higher-order structure and thermal conductivity of their cured resins to obtain highly thermally conductive and insulating epoxy resins. This study focused on the symmetry of the mesogenic part. Four different epoxy monomers were copolymerized with 1,4-phenylenediamine. Cured resins form a nematic-like network. Molecules array more orderly in epoxy resin with the most symmetric epoxy monomer. The thermal conductivities of epoxy resin prepared with ortho-, meta-, and para-substituted epoxy monomer were 0.26, 0.31, and 0.44 W m窶�1 K窶�1, respectively. Epoxy resin with the most symmetric epoxy monomer showed over 1.7 times as high as epoxy resin with low symmetric epoxy monomer. It is clarified that the symmetricity of the primary structure of epoxy monomer is an essential factor for the higher-order structure and thermal conductivity of cured epoxy resin.

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