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Title
Japanese:Development of Polyimides with Low Dielectric Loss Tangent by Incorporating Polysiloxanes with Phenyl Side Groups 
English:Development of Polyimides with Low Dielectric Loss Tangent by Incorporating Polysiloxanes with Phenyl Side Groups 
Author
Japanese: 高橋陸, 澤田梨々花, 畠山歓, Yuta Nabae, 安藤慎治, 早川晃鏡.  
English: Riku Takahashi, Ririka Sawada, Kan Hatakeyama, Yuta Nabae, SHINJI ANDO, Teruaki Hayakawa.  
Language English 
Journal/Book name
Japanese:Macromolecular Rapid Communications 
English:Macromolecular Rapid Communications 
Volume, Number, Page Vol. n/a    No. n/a    pp. 2500115
Published date Apr. 7, 2025 
Publisher
Japanese:John Wiley & Sons, Ltd 
English:John Wiley & Sons, Ltd 
Conference name
Japanese: 
English: 
Conference site
Japanese: 
English: 
Official URL https://doi.org/10.1002/marc.202500115
 
DOI https://doi.org/10.1002/marc.202500115
Abstract Abstract Owing to their low dielectric constant (Dk), processability, and mechanical properties, siloxane-based polymers have attracted attention as insulating materials for next-generation communication. However, a major challenge regarding siloxane-containing materials is their high dielectric loss tangent (dissipation factor) (Df). A polymer is designed and synthesized by combining polysiloxanes with phenyl side groups on the main chain and a polyimide structure (polysiloxane-imide) to improve the Df value. Compared with conventional dimethylsiloxane-based polymers, the resulting polysiloxane-imide, obtained as a bendable, self-supporting film, exhibits a significantly reduced Df value. The rigidity of the phenyl group-containing polysiloxane presumably contributes to the improvement in the Df value. Furthermore, polysiloxane-imides exhibit excellent hydrophobicity and high heat resistance with their 5% weight loss temperature of over 400ﾂ�ﾂｰC. The synthesized polysiloxane-imides with phenyl side groups, which possess various properties, including low Dk, low Df, and excellent hydrophobicity, are expected to contribute to the future practical application of siloxane-based insulating materials.

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