Printed electronics, which realizes micro patterns by using printing technology, is paid more attention in electric industry such as flat panel displays, solar cells, flexible electronics, etc. One of the printing methods of the gravure offset printing will be the most suitable way to realize both first and fine printing in controlling the transferred thickness of pattern. However, in gravure offset printing, fine patterning less than 10 ?m cannot be realized, because the printing stamp fabrication has a limitation to obtain less than around 10 ?m due to the side etching in fabrication process on metal material of the stump. In order to overcome this problem, we proposed a rubber stamp fabricated by photolithography and molding without generating the side etch. However, deformation of the stamp can be influenced on transferring process in turn. In this study, we proposed a method to visualize the deformation of printing stamp during printing in order to study the influence of the deformation of printing stamp. We measured the deformation of the printing stamp compared with FEM analysis, when a controlled pressure was imposed on.
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