Evaluation of Warpage Behavior of an Octagonal Electrodeposited-Au Proof Mass with a Ti/Au Multi-Layered Structures  caused by Thermal Treatment

論文・著書情報

タイトル

和文:	Evaluation of Warpage Behavior of an Octagonal Electrodeposited-Au Proof Mass with a Ti/Au Multi-Layered Structures caused by Thermal Treatment
英文:	Evaluation of Warpage Behavior of an Octagonal Electrodeposited-Au Proof Mass with a Ti/Au Multi-Layered Structures caused by Thermal Treatment

著者

和文:	Tatsuhiko Mori, Tomoyuki Kurioka, Chun-Yi Chen, Tso-Fu Mark Chang, Katsuyuki Machida, Hiroyuki Ito, Yoshihiro Miyake, Masato Sone.
英文:	Tatsuhiko Mori, Tomoyuki Kurioka, Chun-Yi Chen, Tso-Fu Mark Chang, Katsuyuki Machida, Hiroyuki Ito, Yoshihiro Miyake, Masato Sone.

言語

English

掲載誌/書名

和文:
英文:	CPIT2024, New Method of Damage and Failure Analysis of Structural Part

巻, 号, ページ

出版年月

2024年10月14日

出版者

和文:
英文:

会議名称

和文:
英文:	CPIT2024, New Method of Damage and Failure Analysis of Structural Part

開催地

和文:
英文:	OSTRAVA,