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和文:Ortho-, Meta-, versus Para-Substituted Mesogens Inducing Higher-Order Structures for Highly Thermal-Conductive Cured Epoxy Resins 
英文:Ortho-, Meta-, versus Para-Substituted Mesogens Inducing Higher-Order Structures for Highly Thermal-Conductive Cured Epoxy Resins 
著者
和文: 丸井莉花, 前田颯, 畠山歓, Yuta Nabae, 早川晃鏡.  
英文: Rika Marui, Hayato Maeda, Kan Hatakeyama, Yuta Nabae, Teruaki Hayakawa.  
言語 English 
掲載誌/書名
和文:Macromolecules 
英文:Macromolecules 
巻, 号, ページ Vol. 57    No. 23    pp. 11221-11228
出版年月 2024年11月 
出版者
和文:American Chemical Society 
英文:American Chemical Society 
会議名称
和文: 
英文: 
開催地
和文: 
英文: 
公式リンク https://doi.org/10.1021/acs.macromol.4c00506
 
DOI https://doi.org/10.1021/acs.macromol.4c00506
アブストラクト Mesogenic monomers are beneficial, but few studies have investigated the effects of the molecular structure of liquid crystalline epoxy monomers on the higher-order structure and thermal conductivity of their cured resins to obtain highly thermally conductive and insulating epoxy resins. This study focused on the symmetry of the mesogenic part. Four different epoxy monomers were copolymerized with 1,4-phenylenediamine. Cured resins form a nematic-like network. Molecules array more orderly in epoxy resin with the most symmetric epoxy monomer. The thermal conductivities of epoxy resin prepared with ortho-, meta-, and para-substituted epoxy monomer were 0.26, 0.31, and 0.44 W m窶�1 K窶�1, respectively. Epoxy resin with the most symmetric epoxy monomer showed over 1.7 times as high as epoxy resin with low symmetric epoxy monomer. It is clarified that the symmetricity of the primary structure of epoxy monomer is an essential factor for the higher-order structure and thermal conductivity of cured epoxy resin.

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