"ｻﾘﾕｺﾌﾐﾊｲﾙ,井口洋二,HEMTHAVYPASOMPHONE,齋藤滋規,高橋邦夫","くし状構造の積層による側面接触型弾性梁集合体の試作","24rd Symposium on “Microjoining and Assembly Technology in Electronics” Mate2018","24rd Symposium on “Microjoining and Assembly Technology in Electronics”",,,,"pp. 261-264",2018,Jan.