"Xie Centian,K. Fushinobu,R. Yasui,T. Shinoda","Package�fs Solder Crack Detection Technique by Thermal Resistance","‘æ60‰ñ“ú–{“`”MƒVƒ“ƒ|ƒWƒEƒ€","‘æ60‰ñ“ú–{“`”MƒVƒ“ƒ|ƒWƒEƒ€�u‰‰˜_•¶�W",,,,,2023,May
"Xie Centian,Liu Yung Chi,•š�M ˆêŒc,R. Yasui,ŽÂ“c ‘ì–ç","Solder Crack Detection Technique of MLCC by Means of Thermal Resistance Measurement","‘æ60‰ñ“ú–{“`”MƒVƒ“ƒ|ƒWƒEƒ€","‘æ60‰ñ“ú–{“`”MƒVƒ“ƒ|ƒWƒEƒ€�u‰‰˜_•¶�W",,"  I123",,,2023,May