"関口悠","ヤモリの足裏構造にインスピレーションされた凝着デバイス",,"砥粒加工学会誌","公益社団法人砥粒加工学会","Vol. 68","No. 12","pp. 658-661",2024,Dec.
"Jin Woo Han,Yu Sekiguchi,Kazumasa Shimamoto,Haruhisa Akiyama,Chiaki Sato","Effect of rapid interfacial moisture penetration on moisture distribution within adhesive layers",,"Materials Letters","Elsevier","Vol. 381",,"  137768",2024,Nov.
"Keiyu Ikeda,Yu Sekiguchi,Kazumasa Shimamoto,Chiaki Sato","Fracture Energy Determination of Wedge-opening Double Cantilever Beam Tests",,"The Journal of Adhesion","Taylor & Francis","Vol. 101","No. 9","pp. 1143-1162",2024,Nov.
"Jin Woo Han,Yu Sekiguchi,Kazumasa Shimamoto,Haruhisa Akiyama,Chiaki Sato","Direct Measurement of the Diffusion Coefficient of Adhesives from Moisture Distribution in Adhesive Layers Using Near-Infrared Spectroscopy",,"ACS Applied Materials & Interfaces","ACS Publications","Vol. 16","Issue 40","pp. 54610-54626",2024,Sept.
"Shinya Iizuka,Yu Sekiguchi,Chiaki Sato","Measurement of the water vapor transmission rate at temperatures above 100 °C",,"The Journal of Adhesion","Taylor & Francis","Vol. 101","No. 5","pp. 776-793",2024,Aug.
"Jin Woo Han,Yu Sekiguchi,Kazumasa Shimamoto,Haruhisa Akiyama,Chiaki Sato","Experimental investigation of moisture penetration in adhesive layers under varying bonding conditions using near-infrared spectroscopy",,"International Journal of Adhesion and Adhesives","Elsevier","Vol. 134",,"  103792",2024,July
"Yu Sekiguchi","Reliability evaluation of adhesively bonded joints and application to structural parts","第73回高分子学会年次大会","Polymer Preprints, Japan","公益社団法人 高分子学会","Vol. 73","No. 1","  1J20ILY",2024,June
"Keiji Houjou,Kazumasa Shimamoto,Haruhisa Akiyama,Yu Sekiguchi,Chiaki Sato","Analytical Calculation of Relationship Temperature and Fatigue and Creep Strength Based on Thermal Activation",,"Materials","MDPI","Vol. 17","Issue 13","  3055",2024,June
"Akihiro Maesaka,Yushin Kakei,Tsutomu Osaka,Yoshihiro Kudo,Yu Sekiguchi,Chiaki Sato","Experimental approach for measuring the peeling strength of a sheet bonded on a curved adherend with pressure sensitive adhesive and predicting the peeling resistance by finite element analysis",,"The Journal of Adhesion","Taylor & Francis","Vol. 100","No. 16","pp. 1554-1569",2024,Mar.
"Ming Ji,Chao Kang,Yu Sekiguchi,Masanobu Naito,Chiaki Sato","Spectral collocation method for free vibration of sandwich plates containing a viscoelastic core",,"Composite Structures","Elsevier","Vol. 337",,"  118024",2024,Mar.