@article{CTT100928524,
  author = {Daiki Higuma and Jo~ao Vitor Thomsen Silveira and Byunggi Kim and Masahiro Nomura and Kazuyoshi Fushinobu},
  title = {Thermal Property Estimation of Thin-Layered Structures by Means of Thermoreflectance Measurement and Network Identification by Deconvolution Algorithm},
  journal = {Journal of Electronic Packaging},
  year = 2024,
}

@article{CTT100893469,
  author = {J.V. Thomsen Silveira and Z. Li and K. Fushinobu and R. Yasui and T. Shinoda},
  title = {Estimation of Heat Generation in Semiconductors by Inverse Heat Transfer Analysis},
  journal = {IEEE Transactions on Components, Packaging and Manufacturing Technology},
  year = 2023,
}

@article{CTT100875342,
  author = {J.V. Thomsen Silveira and Z. Li and K. Fushinobu and R. Yasui and T. Shinoda},
  title = {Estimation of Heat Generation in Semiconductors Centrally Mounted on Printed Circuit Boards},
  journal = {IEEE Transactions on Components, Packaging and Manufacturing Technology},
  year = 2022,
}

@article{CTT100875337,
  author = {Z. Li and J.V. Thomsen Silveira and K. Fushinobu and H. Nakamizo and R. Yasui and T. Shinoda},
  title = {Heat dissipation measurement of electronic component on PCB by means of external heater and heat flux sensor},
  journal = {Transactions of The Japan Institute of Electronics Packaging},
  year = 2021,
}

@inproceedings{CTT100928528,
  author = {B. Kim and D. Higuma and J. Vitor Thomsen Silveira and K. Fushinobu},
  title = {Quantitative Thermophysical Property Characterization of Thin Layered Structures by Means of Combined Thermoreflectance-Nid Algorithm Technique},
  booktitle = {},
  year = 2024,
}

@inproceedings{CTT100915397,
  author = {THOMSEN SILVEIRA Joao Vitor and 伏信 一慶},
  title = {A power device probe for the thermal network identification of electronic assemblies},
  booktitle = {日本機械学会熱工学コンファレンス2023講演論文集},
  year = 2023,
}

@inproceedings{CTT100892882,
  author = {J.V. Thomsen Silveira and D. Higuma and K. Fushinobu},
  title = {Thermal property estimation of thin layered structures via the pump-probe transient thermoreflectance and network identification methods},
  booktitle = {Proc. 8th TFEC},
  year = 2023,
}

@inproceedings{CTT100892726,
  author = {J.V. Thomsen Silveira and D. Higuma and K. Fushinobu},
  title = {Visualization of Thermal Networks in Layered Structures by Means of Pump-Probe and Deconvolution Technique},
  booktitle = {Proc. PSFVIP13},
  year = 2022,
}

@inproceedings{CTT100851457,
  author = {中溝 裕紀 and J.V. Thomsen Silveira and 伏信 一慶 and 篠田 卓也},
  title = {非定常熱流検出による電子部品の消費電力計測手法の提案 − 熱流センサによる非破壊高速検出手法},
  booktitle = {第58回日本伝熱シンポジウム講演論文集},
  year = 2021,
}

@inproceedings{CTT100816025,
  author = {Z. Li and J.V. Thomsen Silveira and K. Fushinobu and R. Yasui and T. Shinoda},
  title = {Heat dissipation measurement of multiple electronic components on ECU by means of external heater and heat flux sensor},
  booktitle = {Proc. ISTP30},
  year = 2019,
}

@inproceedings{CTT100816026,
  author = {J.V. Thomsen Silveira and Z. Li and K. Fushinobu and R. Yasui and T. Shinoda},
  title = {Transient thermal response investigation of multiple heat-source electronic systems},
  booktitle = {Proc. ISTP30},
  year = 2019,
}

@inproceedings{CTT100815569,
  author = {J.V. Thomsen Silveira and Z. Li and B. Yang and R. Yasui and T. Shinoda and K. Fushinobu},
  title = {Analysis of heat transfer from a heat dissipating device on a substrate},
  booktitle = {Proc. ITherm2019},
  year = 2019,
}

@inproceedings{CTT100815571,
  author = {Z. Li and J.V. Thomsen Silveira and K. Fushinobu and R. Yasui and T. Shinoda},
  title = {Heat dissipation measurement of electronic component by means of external heater and heat flux sensor},
  booktitle = {第56回日本伝熱シンポジウム講演論文集},
  year = 2019,
}

@inproceedings{CTT100815570,
  author = {J.V. Thomsen Silveira and Z. Li and K. Fushinobu and R. Yasui and T. Shinoda},
  title = {3D thermal analysis on PCBs with multiple surface mounted semiconductor devices by using an FEM-mased open source PDE solver},
  booktitle = {第56回日本伝熱シンポジウム講演論文集},
  year = 2019,
}

@inproceedings{CTT100789786,
  author = {J.V. Thomsen Silveira and B. Yang and Z. Li and K. Fushinobu and R. Yasui and T. Shinoda},
  title = {Heat dissipation measurement technique of semiconductor devices on printed circuit board by using heat flow sensor},
  booktitle = {日本機械学会熱工学コンファレンス2018講演論文集},
  year = 2018,
}

@misc{CTT100901726,
  author = {Joao Vitor Thomsen Silveira},
  title = {Characterization of thermal parameters of electronic assemblies by means of in situ measurements},
  year = 2023,
}

@misc{CTT100908156,
  author = {Joao Vitor Thomsen Silveira},
  title = {Characterization of thermal parameters of electronic assemblies by means of in situ measurements},
  year = 2023,
}

@misc{CTT100901728,
  author = {Joao Vitor Thomsen Silveira},
  title = {Characterization of thermal parameters of electronic assemblies by means of in situ measurements},
  year = 2023,
}

@misc{CTT100901727,
  author = {Joao Vitor Thomsen Silveira},
  title = {Characterization of thermal parameters of electronic assemblies by means of in situ measurements},
  year = 2023,
}



@phdthesis{CTT100901726,
  author = {Joao Vitor Thomsen Silveira},
  title = {Characterization of thermal parameters of electronic assemblies by means of in situ measurements},
  school = {東京工業大学},
  year = 2023,
}

@phdthesis{CTT100908156,
  author = {Joao Vitor Thomsen Silveira},
  title = {Characterization of thermal parameters of electronic assemblies by means of in situ measurements},
  school = {東京工業大学},
  year = 2023,
}

@phdthesis{CTT100901728,
  author = {Joao Vitor Thomsen Silveira},
  title = {Characterization of thermal parameters of electronic assemblies by means of in situ measurements},
  school = {東京工業大学},
  year = 2023,
}

@phdthesis{CTT100901727,
  author = {Joao Vitor Thomsen Silveira},
  title = {Characterization of thermal parameters of electronic assemblies by means of in situ measurements},
  school = {東京工業大学},
  year = 2023,
}