@inproceedings{CTT100908495,
  author = {Norio Chujo and Hiroyuki Ryoson and Koji Sakui and Shinji Sugatani and Tomoji Nakamura and Takayuki Ohba},
  title = {Electrical and Thermal Analysis of Bumpless Build Cube 3D Using Wafer-on-Wafer and Chip-on-Wafer for Near Memory Computing},
  booktitle = {},
  year = 2023,
}

@inproceedings{CTT100908496,
  author = {Norio Chujo and Koji Sakui and Shinji Sugatani and Hiroyuki Ryoson and Tomoji Nakamura and Takayuki Ohba},
  title = {Bumpless Build Cube (BBCube) 3D: Heterogeneous 3D Integration Using WoW and CoW to Provide TB/s Bandwidth with Lowest Bit Access Energy},
  booktitle = {},
  year = 2023,
}

@misc{CTT100939414,
  author = {大場隆之 and 菅谷慎二 and 田口　眞男},
  title = {半導体装置},
  howpublished = {公開特許},
  year = 2025,
  month  = {},
  note   = {PCT/JP2025/001229(2025/01/16), WO 2025/158999(2025/07/31)}
}


@misc{CTT100939740,
  author = {大場隆之 and 菅谷慎二 and 田口　眞男},
  title = {半導体装置},
  howpublished = {公開特許},
  year = 2025,
  month  = {},
  note   = {特願2024-009036(2024/01/24), 特開2025-114376(2025/08/05)}
}