@article{CTT100874041,
  author = {Yi-Chieh Tsai and Chia-Hsuan Lee and Hsin-Chi Chang and Jui-Han Liu and Han-Wen Hu and Hiroyuki Ito and Young Suk Kim and Takayuki Ohba and Kuan-Neng Chen},
  title = {Electrical Characteristics and Reliability of Wafer-on-Wafer (WOW) Bumpless Through Silicon Via},
  journal = {IEEE Transactions on Electron Devices},
  year = 2021,
}

@article{CTT100820708,
  author = {Yi-Lun Yang and Hiroyuki Ito and Kim Youngsuk and Takayuki Ohba and Kuan-Neng Chen},
  title = {Evaluation of Metal/Polymer Adhesion and Highly Reliable Four-Point Bending Test Using Stealth Dicing Method in 3D Integration},
  journal = {IEEE Transactions on Components, Packaging and Manufacturing Technology},
  year = 2020,
}

@inproceedings{CTT100820715,
  author = {Yi-Lun Yang and Jia-Ling Liu and Guan Wei Chen and Shoichi  Kodama and Kyosuke Kobinata and Kuan-Neng Chen and Hiroyuki Ito and Kim Youngsuk and Takayuki Ohba},
  title = {Highly Reliable Four-Point Bending Test Using Stealth Dicing Method for Adhesion Evaluation},
  booktitle = {},
  year = 2019,
}