@article{CTT100828202,
  author = {Takehiko Kikuchi and Liu Bai and Takuya Mitarai and Hideki Yagi and Masato Furukawa and Tomohiro Amemiya and Nobuhiko Nishiyama and Shigehisa Arai},
  title = {Enhanced bonding strength of InP/Si chip-on-wafer by plasma-activated bonding using stress-controlled interlayer},
  journal = {Japanese Journal of Applied Physics},
  year = 2020,
}

@article{CTT100821117,
  author = {Takehiko Kikuchi and Liu Bai and Takuya Mitarai and Hideki Yagi and Masato Furukawa and Tomohiro Amemiya and Nobuhiko Nishiyama and Shigehisa Arai},
  title = {Enhanced bonding strength of InP/Si chip-on-wafer by plasma-activated bonding using stress-controlled interlayer},
  journal = {Japanese Journal of Applied Physics},
  year = 2019,
}

@article{CTT100770546,
  author = {Junichi Suzuki and Fumihito Tachibana and Kumi Nagasaka and Moataz S. A. M. Eissa and Liu Bai and Takuya Mitarai and Tomohiro Amemiya and Nobuhiko Nishiyama and Shigehisa Arai},
  title = {Highly efficient double-taper-type coupler between III-V/Silicon-on-insulator hybrid device and silicon waveguide},
  journal = {Japanese Journal of Applied Physics},
  year = 2018,
}

@inproceedings{CTT100803284,
  author = {菊地 健彦 and 白 柳 and 御手洗 拓矢 and 八木 英樹 and 新田 俊之 and 古川 将人 and 雨宮 智宏 and 西山 伸彦},
  title = {引張り歪層によるSi基板上InP小片接合界面の垂直応力抑制},
  booktitle = {},
  year = 2019,
}

@inproceedings{CTT100831902,
  author = {N. Nishiyama and K. Ohira and L. Bai and Y. Kurita and H. Furuyama and M. Inamura and T. Abe and T. Mitarai and K. Morita and S. Arai},
  title = {Thin Film Optical Characteristics of InP/Si Hybrid Wafers by Chip-on-Wafer Direct Transfer Bonding Technology},
  booktitle = {},
  year = 2019,
}

@inproceedings{CTT100803265,
  author = {Takehiko Kikuchi and Liu Bai and Takuya Mitarai and Hideki Yagi and Tomohiro Amemiya and Nobuhiko Nishiyama and Shigehisa Arai},
  title = {High Yield Chip-on-wafer Low Temperature Plasma Activated Bonding for III-V/Si Hybrid Photonic Integration},
  booktitle = {},
  year = 2019,
}

@inproceedings{CTT100803297,
  author = {白 柳 and 菊地 健彦 and 御手洗 拓矢 and 西山 伸彦 and 八木 英樹 and 雨宮 智宏 and 荒井 滋久},
  title = {Investigation of stress dependence on bonding strength for III-V/Si chip-on-wafer by plasma activated bonding},
  booktitle = {},
  year = 2019,
}

@inproceedings{CTT100785187,
  author = {御手洗 拓矢 and MOATAZShaher Anis Mahmoud Eissa and 宮嵜 隆之 and 立花 文人 and 白 柳 and 王 雨寧 and 雨宮 智宏 and 西山 伸彦 and 荒井 滋久},
  title = {Si曲げ導波路による方向性光結合器を用いた広帯域ループミラーの作製},
  booktitle = {},
  year = 2018,
}

@inproceedings{CTT100803300,
  author = {白 柳 and 菊地 健彦 and 御手洗 拓矢 and 西山 伸彦 and 八木 英樹 and 雨宮 智宏 and 荒井 滋久},
  title = {Examination of Chip-on-Wafer Plasma Activated Bonding Technology for III-V on Si hybrid Photonic Integrated Circuits},
  booktitle = {IEICE technical report},
  year = 2018,
}

@inproceedings{CTT100774696,
  author = {Yuning Wang and Kumi Nagasaka and Junichi Suzuki and Liu Bai and Takuya Mitarai and Tomohiro Amemiya and Nobuhiko Nishiyama and Shigehisa Arai},
  title = {Photoluminescence properties of GaInAs/InP layers by Ar fast atom beam for room temperature surface activated bonding toward hybrid PIC},
  booktitle = {},
  year = 2018,
}

@inproceedings{CTT100759534,
  author = {鈴木 純一 and 立花 文人 and 永坂 久美 and モータズ エイッサ and 白 柳 and 御手洗 拓矢 and 雨宮 智宏 and 西山 伸彦 and 荒井 滋久},
  title = {III-V/SOI ハイブリッドデバイス/Si 細線導波路間テーパ型モード変換器の構造評価},
  booktitle = {},
  year = 2018,
}

@inproceedings{CTT100758309,
  author = {白 柳 and 菊地 健彦 and 鈴木 純一 and 永坂 久美 and 西山 伸彦 and 八木 英樹 and 雨宮 智宏 and 荒井滋久},
  title = {III-V/Siハイブリッド部分直接接合における非破壊接合状況確認法の提案},
  booktitle = {},
  year = 2018,
}

@inproceedings{CTT100758292,
  author = {鈴木 純一 and 永坂 久美 and モータズ エイッサ and 立花 文人 and 白 柳 and 御手洗 拓矢 and 雨宮 智宏 and 西山 伸彦 and 荒井 滋久},
  title = {III-V/SOIハイブリッドデバイスとSi導波路接続用テーパ型モード変換器構造の検討},
  booktitle = {},
  year = 2017,
}