@misc{CTT100866662,
  author = {Kentaro Mori},
  title = {Embedded Die and Fan-Out Packaging Technologies Enabling High Density and Reliable 2D/3D Integration for System in Package},
  year = 2022,
}

@misc{CTT100866663,
  author = {Kentaro Mori},
  title = {Embedded Die and Fan-Out Packaging Technologies Enabling High Density and Reliable 2D/3D Integration for System in Package},
  year = 2022,
}

@misc{CTT100894914,
  author = {Kentaro Mori},
  title = {Embedded Die and Fan-Out Packaging Technologies Enabling High Density and Reliable 2D/3D Integration for System in Package},
  year = 2022,
}



@phdthesis{CTT100866662,
  author = {Kentaro Mori},
  title = {Embedded Die and Fan-Out Packaging Technologies Enabling High Density and Reliable 2D/3D Integration for System in Package},
  school = {東京工業大学},
  year = 2022,
}

@phdthesis{CTT100866663,
  author = {Kentaro Mori},
  title = {Embedded Die and Fan-Out Packaging Technologies Enabling High Density and Reliable 2D/3D Integration for System in Package},
  school = {東京工業大学},
  year = 2022,
}

@phdthesis{CTT100894914,
  author = {Kentaro Mori},
  title = {Embedded Die and Fan-Out Packaging Technologies Enabling High Density and Reliable 2D/3D Integration for System in Package},
  school = {東京工業大学},
  year = 2022,
}