発明者,発明の名称,種別,状態,出願人,出願日,出願番号,公開日,公開番号,登録日,登録番号
"酒井徹志,加藤　樹里,岡　秀明,金本　啓,原　寿樹","半導体装置の製造方法","特許","登録","国立大学法人東京工業大学, セイコーエプソン株式会社","2006/03/15","特願2006-071328","2007/03/01","特開2007-053332","特許第4231909号","2008/12/19"
"酒井徹志,加藤　樹里,岡　秀明,金本　啓,原　寿樹","半導体装置および半導体装置の製造方法","特許","登録","国立大学法人東京工業大学, セイコーエプソン株式会社","2005/09/30","特願2005-288877","2007/04/19","特開2007-103490","特許第4644577号","2010/12/10"
"酒井徹志,加藤　樹里,原　寿樹,金本　啓","半導体装置および半導体装置の製造方法","特許","公開","国立大学法人東京工業大学, セイコーエプソン株式会社","2005/09/30","特願2005-288876","2007/04/19","特開2007-103489",,
"酒井徹志,加藤　樹里,岡　秀明,金本　啓,原　寿樹","半導体装置および半導体装置の製造方法","特許","公開","国立大学法人東京工業大学, セイコーエプソン株式会社","2005/09/30","特願2005-288878","2007/04/19","特開2007-103491",,
"酒井徹志,原　寿樹,加藤　樹里,岡　秀明,金本　啓","半導体装置の製造方法","特許","公開","国立大学法人東京工業大学, セイコーエプソン株式会社","2005/08/26","特願2005-246124","2007/03/08","特開2007-059804",,
"酒井徹志,原　寿樹","半導体基板の製造方法及び、半導体装置の製造方法","特許","登録","国立大学法人東京工業大学, セイコーエプソン株式会社","2005/08/10","特願2005-231849","2007/02/22","特開2007-048949","特許第4852275号","2011/10/28"
"酒井徹志,岡　秀明,加藤　樹里,原　寿樹,金本　啓","半導体装置の製造方法","特許","登録","国立大学法人東京工業大学, セイコーエプソン株式会社","2005/07/22","特願2005-212747","2007/02/08","特開2007-035701","特許第4726120号","2011/04/22"
"酒井徹志,金本　啓,原　寿樹,岡　秀明,加藤　樹里","半導体基板の製造方法及び、半導体装置の製造方法","特許","登録","国立大学法人東京工業大学, セイコーエプソン株式会社","2005/07/20","特願2005-209809","2007/02/01","特開2007-027542","特許第4649282号","2010/12/17"
"酒井徹志,大見俊一郎,山崎　崇","半導体基板、半導体装置及び半導体基板の作成方法","特許","公開","国立大学法人東京工業大学","2004/10/04","特願2005-514563","2005/04/21","特再表2005-036638",,