発明者,発明の名称,種別,状態,出願人,出願日,出願番号,公開日,公開番号,登録日,登録番号
"大場隆之,中條　徳男","積層メモリ","特許","公開","国立大学法人東京工業大学","2021/12/06","特願2021-197979","2023/06/16","特開2023-083955",,
"大場隆之,菅谷　慎二　","積層デバイスの製造方法、および、積層デバイス","特許","公開","国立大学法人東京工業大学, 株式会社アドバンテスト","2021/09/29","特願2021-159670","2023/04/10","特開2023-049739",,
"大場隆之,作井　康司","半導体装置","特許","公開","国立大学法人東京工業大学","2021/09/21","特願2021-153314","2023/04/03","特開2023-045099",,
"大場隆之,菅谷　慎二","半導体装置","特許","公開","国立大学法人東京工業大学, 株式会社アドバンテスト","2021/07/09","特願2021-113963","2023/01/20","特開2023-010103",,
"大場隆之","半導体装置及びその製造方法","特許","公開","国立大学法人東京工業大学","2021/04/13","特願2021-067855","2022/10/25","特開2022-162831",,
"大場隆之","半導体装置及びその製造方法","特許","公開","国立大学法人東京工業大学","2020/12/25","特願2020-217061","2022/07/07","特開2022-102371",,
"大場隆之","半導体装置及びその製造方法","特許","公開","国立大学法人東京工業大学","2020/12/25","特願2020-217060","2022/07/07","特開2022-102370",,
"大場隆之,作井　康司　","半導体装置とその製造方法","特許","登録","国立大学法人東京工業大学, 本田技研工業株式会社","2020/03/06","特願2020-038818","2021/09/16","特開2021-141240","特許第7424580号","2024/01/22"
"大場隆之,作井　康司　","半導体装置とその制御方法","特許","公開","国立大学法人東京工業大学, 本田技研工業株式会社","2020/03/06","特願2020-038815","2021/09/16","特開2021-140555",,
"大場隆之,作井　康司　","半導体装置および半導体装置の製造方法","特許","登録","国立大学法人東京工業大学, 本田技研工業株式会社","2020/03/06","特願2020-038816","2021/09/16","特開2021-141238","特許第7411959号","2023/12/28"
"大場隆之,作井　康司　","半導体装置の製造方法","特許","登録","国立大学法人東京工業大学, 本田技研工業株式会社","2020/03/06","特願2020-038817","2021/09/16","特開2021-141239","特許第7357288号","2023/09/28"
"大場隆之,作井　康司　","半導体装置","特許","登録","国立大学法人東京工業大学, 本田技研工業株式会社","2020/01/16","特願2020-005051","2021/08/05","特開2021-114347","特許第7340178号","2023/08/30"
"大場隆之,菅谷　慎二　","３次元デバイスおよび３次元デバイスを製造する方法","特許","登録","国立大学法人東京工業大学, 株式会社アドバンテスト","2019/12/25","特願2019-234428","2021/07/15","特開2021-103735","特許第7403765号","2023/12/15"
"大場隆之,作井　康司","半導体装置","特許","公開","国立大学法人東京工業大学, 本田技研工業株式会社","2019/10/17","特願2019-190110","2021/04/22","特開2021-064762",,
"大場隆之,作井　康司　","半導体装置","特許","公開","国立大学法人東京工業大学, 本田技研工業株式会社","2019/10/17","特願2019-190528","2021/04/30","特開2021-068737",,
"大場隆之,作井　康司　","半導体装置","特許","登録","国立大学法人東京工業大学, 本田技研工業株式会社","2019/10/04","特願2019-183712","2021/04/15","特開2021-061292","特許第7272587号","2023/05/01"
"大場隆之,作井　康司　","半導体装置","特許","登録","国立大学法人東京工業大学, 本田技研工業株式会社","2019/10/04","特願2019-183605","2021/04/15","特開2021-061078","特許第7282329号","2023/05/19"
"大場隆之,作井　康司　","半導体装置","特許","登録","国立大学法人東京工業大学, 本田技研工業株式会社","2019/09/13","特願2019-167207","2021/03/18","特開2021-044045","特許第7320227号","2023/07/26"
"大場隆之,作井　康司","半導体装置","特許","登録","国立大学法人東京工業大学, 本田技研工業株式会社","2019/03/18","特願2019-050061","2020/09/24","特開2020-155474","特許第7222481号","2023/02/07"
"大場隆之,作井　康司　","半導体装置","特許","登録","国立大学法人東京工業大学, 本田技研工業株式会社","2019/03/18","特願2019-050060","2020/09/24","特開2020-155473","特許第7255797号","2023/04/03"
"大場隆之","半導体装置の製造方法","特許","登録","国立大学法人東京工業大学","2014/09/16","特願2014-187540","2016/04/25","特開2016-062951","特許第6485897号","2019/03/01"
"大場隆之","血小板産生デバイス及び血小板産生流路装置","特許","公開","国立大学法人東京工業大学","2014/02/28","特願2014-039729","2015/09/10","特開2015-163060",,
"大場隆之","半導体装置及びその製造方法","特許","登録","国立大学法人東京工業大学","2014/02/28","特願2014-039730","2015/09/10","特開2015-164160","特許第6440291号","2018/11/30"
"大場隆之,児玉　祥一　,荒井　一尚","半導体装置の製造方法","特許","登録","国立大学法人東京工業大学","2013/12/19","特願2013-263012","2015/06/25","特開2015-119109","特許第6341554号","2018/05/25"
"大場隆之,前田　展秀,荒井　一尚","半導体装置及びその製造方法","特許","登録","国立大学法人東京工業大学","2013/12/19","特願2013-263013","2015/06/25","特開2015-119110","特許第6393036号","2018/08/31"
"大場隆之,金　永,荒井　一尚","半導体装置及びその製造方法","特許","登録","国立大学法人東京工業大学","2013/12/19","特願2013-263014","2015/06/25","特開2015-119111","特許第6360299号","2018/06/29"