"K. Hashimoto,R. Yasui,M. Inaba,T. Egami,Y. Ariga,D. Mukoyama,H. Takei,KAZUYOSHI FUSHINOBU,Takuya Shinoda,K. Ohomi","MBDを利用した放熱材料配置のロバスト設計","自動車技術会2024年春季大会学術講演会","自動車技術会2024年春季大会学術講演会予稿集",,"  277",,,2024,May
"Yuanting Shen,H. Nakamizo,Takuya Shinoda,R. Yasui,KAZUYOSHI FUSHINOBU","伝熱計測による次世代自動車用電子機器発熱量の予測","第61回日本伝熱シンポジウム","第61回日本伝熱シンポジウム講演論文集",,"  D131",,,2024,May
"Hiromu Ishii,H. Matsuoka,KAZUYOSHI FUSHINOBU,Takuya Shinoda","車載用ECUジャンクション温度低減のための接触熱抵抗の予測","第61回日本伝熱シンポジウム","第61回日本伝熱シンポジウム講演論文集",,"  D121",,,2024,May
"K. Hashimoto,Riyo Kawakami,R. Yasui,Y. Matsuda,KAZUYOSHI FUSHINOBU,Takuya Shinoda,K. Ohomi","ECUの伝熱設計における機械学習と熱回路網法を併用した解析時間の短縮","第61回日本伝熱シンポジウム","第61回日本伝熱シンポジウム講演論文集",,"  D134",,,2024,May
"Xie Centian,K. Fushinobu,R. Yasui,T. Shinoda","Package’s Solder Crack Detection Technique by Thermal Resistance","第60回日本伝熱シンポジウム","第60回日本伝熱シンポジウム講演論文集",,,,,2023,May
"C. Xie,Y. Liu,K. Fushinobu,R. Yasui,T. Shinoda","Solder Crack Detection Technique of MLCC by Means of Thermal Resistance Measurement","第60回日本伝熱シンポジウム","第60回日本伝熱シンポジウム講演論文集",,"  I123",,,2023,May
"Riyo Kawakami,Kazunari Hashimoto,Ryuta Yasui,KAZUYOSHI FUSHINOBU,Takuya Shinoda","ECUにおける放熱材を応用した伝熱設計に関する研究","第60回日本伝熱シンポジウム","第60回日本伝熱シンポジウム講演論文集",,,,,2023,May
"Kazunari Hashimoto,Riyo Kawakami,Ryuta Yasui,Haruki Takei,KAZUYOSHI FUSHINOBU,Takuya Shinoda,Keita Oumi","半導体モデルを利用した放熱材料の最適配置","自動車技術会2021年春季大会学術講演会","自動車技術会2023年春季大会学術講演会予稿集",,,,,2023,May
"M. Inaba,Hiroki Nakamizo,Wataru Hijikata,T. Okura,Ryuta Yasui,HIROKI TAKAHARA,KAZUYOSHI FUSHINOBU,Hideaki Fujita,Takuya Shinoda,Keita Oumi","動的アクチュエータのモデリングによる発熱量損失算出の提案","自動車技術会2021年春季大会学術講演会","自動車技術会2023年春季大会学術講演会予稿集",,,,,2023,May
"J.V. Thomsen Silveira,Z. Li,K. Fushinobu,R. Yasui,T. Shinoda","Estimation of Heat Generation in Semiconductors by Inverse Heat Transfer Analysis",,"IEEE Transactions on Components, Packaging and Manufacturing Technology",,"Vol. 13","No. 3","pp. 315-322",2023,
"H. Nakamizo,R. Yasui,Takuya Shinoda,KAZUYOSHI FUSHINOBU,T. Tomimura","うねりやひずみを伴う金属個体間の接触熱抵抗の予測方法の提案","第59回日本伝熱シンポジウム","第59回日本伝熱シンポジウム講演論文集",,,,,2022,May
"J.V. Thomsen Silveira,Z. Li,K. Fushinobu,R. Yasui,T. Shinoda","Estimation of Heat Generation in Semiconductors Centrally Mounted on Printed Circuit Boards",,"IEEE Transactions on Components, Packaging and Manufacturing Technology",,"Vol. 12","No. 2","pp. 280",2022,
"Yuki MORISAKI,Minoru TANAKA,Satoshi TAKEUCHI,Atushi SHINMA,Koichi TANAKA,Sayaka OKABE,Takuya SHINODA,Tatsuya KAWAGUCHI,Takushi SAITO","Cooling rate estimation in thickness direction of injection molded PPS plate by enthalpy measurement of crystalline fusion","プラスチック成形加工学会第32回年次大会","Preprints of Seikei-Kakou Annual Meeting 2021",,,,"pp. 175-176",2021,June
"中溝 裕紀,Joao Vitor Thomsen Silveira,KAZUYOSHI FUSHINOBU,Takuya Shinoda","非定常熱流検出による電子部品の消費電力計測手法の提案 − 熱流センサによる非破壊高速検出手法","第58回日本伝熱シンポジウム","第58回日本伝熱シンポジウム講演論文集",,,,,2021,May
"H. Nazamizo,W. Wonsub,Karim Rasyid Karjadi,R. Yasui,Takuya Shinoda,KAZUYOSHI FUSHINOBU,H. Tomimura","ECU車両組付け時における接触熱抵抗の低減手法及び予測方法の提案","自動車技術会2021年春季大会学術講演会","自動車技術会2021年春季大会学術講演会予稿集",,,,,2021,May
"Takuya Shinoda,Hiramatsu,Yung Chi Liu,R. Yasui,KAZUYOSHI FUSHINOBU","はんだ接続部の微細疲労き裂測定技術の開発 − 熱抵抗によるダイオードのはんだクラックの検出","第58回日本伝熱シンポジウム","第58回日本伝熱シンポジウム講演論文集",,,,,2021,May
"R. Yasui,Yung Chi Liu,Takuya Shinoda,KAZUYOSHI FUSHINOBU","はんだ接続部の微細疲労き裂測定技術の開発 − チップコンデンサのはんだクラック非破壊検出","第58回日本伝熱シンポジウム","第58回日本伝熱シンポジウム講演論文集",,,,,2021,May
"Takuya Shinoda,Ryuta Yasui,Woo Wonsub,Karim Rasyid Karjadi,Hiroki Nakamizo,KAZUYOSHI FUSHINOBU,Hisao Tomimura","Study on thermal contact resistance between bolted flat plates (Proposal of reduction method for thermal contact resistance by means of arc shaped waviness)",,"Thermal Science and Engineering",,"Vol. 29","No. 1","  23-32",2021,Jan.
"Z. Li,H. Haketa,K. Fushinobu,R. Yasui,T. Shinoda","In-situ Diagnosis of Solder Joint Failure by Means of Thermal Resistance Measurement",,"Microelectronics Reliability",,"Vol. 123",,,2021,
"Z. Li,J.V. Thomsen Silveira,K. Fushinobu,H. Nakamizo,R. Yasui,T. Shinoda","Heat dissipation measurement of electronic component on PCB by means of external heater and heat flux sensor",,"Transactions of The Japan Institute of Electronics Packaging",,"Vol. 14",,"pp. E21-003-1",2021,
"Takuya Shinoda,KAZUYOSHI FUSHINOBU,Hiroaki Maki,Yung Chi Liu,Ryuta Yasui,Hiroki Nakamizo","過渡熱抵抗でのはんだクラック率測定","第57回日本伝熱シンポジウム","第57回日本伝熱シンポジウム講演論文集",,,,,2020,June
"J.V. Thomsen Silveira,Z. Li,K. Fushinobu,R. Yasui,T. Shinoda","Transient thermal response investigation of multiple heat-source electronic systems","ISTP30","Proc. ISTP30",,,"No. ISTP212",,2019,Nov.
"T. Shinoda,R. Yasui,W. Woo,K. Fushinobu,T. Tomimura","Influence of two screw fastening distances on contact thermal resistance","ISTP30","Proc. ISTP30",,,"No. ISTP021",,2019,Nov.
"H. Maki,K. Fushinobu,R. Yasui,T. Shinoda","Non-destructive Diagnosis of solder Joint Failure by Means of Thermal Resistance Measurement","ISTP30","Proc. ISTP30",,,"No. ISTP150",,2019,Nov.
"Z. Li,J.V. Thomsen Silveira,K. Fushinobu,R. Yasui,T. Shinoda","Heat dissipation measurement of multiple electronic components on ECU by means of external heater and heat flux sensor","ISTP30","Proc. ISTP30",,,"No. ISTP134",,2019,Nov.
"J.V. Thomsen Silveira,Z. Li,B. Yang,R. Yasui,T. Shinoda,K. Fushinobu","Analysis of heat transfer from a heat dissipating device on a substrate","ITherm 2019","Proc. ITherm2019",,,"No. 400",,2019,May
"Takuya Shinoda,安井 竜太,K. Karjadi,KAZUYOSHI FUSHINOBU,富村 寿夫","大きなうねりを有する固体間の接触熱抵抗の測定手法","第56回日本伝熱シンポジウム","第56回日本伝熱シンポジウム講演論文集",,,"No. D111",,2019,May
"Z. Li,J.V. Thomsen Silveira,K. Fushinobu,R. Yasui,T. Shinoda","Heat dissipation measurement of electronic component by means of external heater and heat flux sensor","第56回日本伝熱シンポジウム","第56回日本伝熱シンポジウム講演論文集",,,"No. D112",,2019,May
"J.V. Thomsen Silveira,Z. Li,K. Fushinobu,R. Yasui,T. Shinoda","3D thermal analysis on PCBs with multiple surface mounted semiconductor devices by using an FEM-mased open source PDE solver","第56回日本伝熱シンポジウム","第56回日本伝熱シンポジウム講演論文集",,,"No. D124",,2019,May
"J.V. Thomsen Silveira,B. Yang,Z. Li,K. Fushinobu,R. Yasui,T. Shinoda","Heat dissipation measurement technique of semiconductor devices on printed circuit board by using heat flow sensor","日本機械学会熱工学コンファレンス2016","日本機械学会熱工学コンファレンス2018講演論文集",,,,,2018,Oct.
"Hiroyuki Haketa,Zi Di Li,KAZUYOSHI FUSHINOBU,安井 竜太,Takuya Shinoda","In-situ Diagnosis of Solder Joint Failure by Means of Thermal Resistance Measurement","第55回日本伝熱シンポジウム","第55回日本伝熱シンポジウム講演論文集",,,,,2018,May
"H. Haketa,M. Reininger,K. Fushinobu,H. Nakamizo,R. Yasui,T. Shinoda","In-situ Diagnosis of Solder Joint Failure by Means of Thermal Resistance Measurement","ASME IMECE2017",,,,,,2017,Nov.