"‘å“à‘ñŽÀ,’·”ör—S,’†‘º—æ—Y,’|‘ºWˆê,Žu‘º•‘–],’ª“c—º‘¾,”Ñ·‘ñŽk,¬X•¶•v,•½ŽR”Ž”V,’†’ÒŠ°","Si(111)ã3~ã3-B •\–Êã‚ÌBi(110)’´”––Œ‚Ì“dŽqó‘Ô‚É‚¨‚¯‚éŠî”ˆˑ¶«","“ú–{•¨—Šw‰ï‘æ76‰ñ”NŽŸ‘å‰ï",,,,,,2022,Mar. "‘å“à‘ñŽÀ,’†‘º—æ—Y,’|‘ºWˆê,Žu‘º•‘–],’ª“c—º‘¾,”Ñ·‘ñŽk,¬X•¶•v,•½ŽR”Ž”V,’†’ÒŠ°","Si(111)ã3~ã3-B•\–Êã‚ÌBi(110)’´”––Œ‚Ì“dŽqó‘Ô","2021”N“ú–{•\–Ê^‹óŠw‰ïŠwpu‰‰‰ï",,,,,,2021,Nov. "T. Ouchi,L. Nakamura,K. Takemura,M. Shimura,R. Ushioda,T. Iimori,F. Komori,H. Hirayama,K. Nakatsuji","Electronic structure of Bi(110) ultra-thin films grown on n-type Si(111)ã3~ã3-B substrates","13th International Symposium on Atomic Level Characterization for New Materials and Devices (ALCf21)",,,,,,2021,Oct. "’†‘º—æ—Y,Ÿ–“˜B,’ª“c—º‘¾,‘å“à‘ñŽÀ,¬X•¶•v,”Ñ·‘ñŽk,•½ŽR”Ž ”V,’†’ÒŠ°","n-type Si(111)ã3~ã3-B •\–Êã‚ÌBi(110)’´”––Œ‚Ì“dŽqó‘Ô","“ú–{•¨—Šw‰ï‘æ76‰ñ”NŽŸ‘å‰ï",,,,,,2021,Mar. "Ÿ–“˜B,’†‘º—æ—Y,‹à–ì’B,–Ø‘º²”Ž,‘å“à‘ñŽÀ,‰i—FŒc,“c’†˜a–ç,‰ºì—T—,¬àVŒ’ˆê,ŠÔ£ˆê•F,¬X•¶•v,”Ñ·‘ñŽk,•½ŽR”Ž”V,’†’ÒŠ°","Si(111)ã3~ã3-(Bi,In)•\–Ê‚Ì“dŽqó‘Ô","“ú–{•¨—Šw‰ï‘æ76‰ñ”NŽŸ‘å‰ï",,,,,,2021,Mar. "‹à–ì’B,Ÿ–“˜B,–Ø‘º²”Ž,’†‘º—æ—Y,”ŠÑ—º‘¾,ŽR莘Y,¬àVŒ’ˆê,ŠÔ£ˆê•F,”Ñ·‘ñŽk,¬X•¶•v,•½ŽR”Ž”V,’†’ÒŠ°","Si(110)3~2-Bi•\–Ê‚Ì“dŽqó‘Ô","2020”N“ú–{•\–Ê^‹óŠw‰ïŠwpu‰‰‰ï",,,,,,2020,Nov. "‹à–ì’B,Ÿ–“˜B,–Ø‘º²”Ž,’†‘º—æ—Y,ŽR莘Y,¬àVŒ’ˆê,ŠÔ£ˆê•F,”Ñ·‘ñŽk,¬X•¶•v,•½ŽR”Ž”V,’†’ÒŠ°","Si(110)3x2-Bi•\–Ê‚Ì“dŽqó‘Ô","“ú–{•¨—Šw‰ï‘æ75‰ñ”NŽŸ‘å‰ï",,,,,,2020,Mar.