"Norio Chujo,Hiroyuki Ryoson,Koji Sakui,Shinji Sugatani,Tomoji Nakamura,Takayuki Ohba","Electrical and Thermal Analysis of Bumpless Build Cube 3D Using Wafer-on-Wafer and Chip-on-Wafer for Near Memory Computing","2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)",,"IEEE",,,,2023,Aug.
"Norio Chujo,Koji Sakui,Shinji Sugatani,Hiroyuki Ryoson,Tomoji Nakamura,Takayuki Ohba","Bumpless Build Cube (BBCube) 3D: Heterogeneous 3D Integration Using WoW and CoW to Provide TB/s Bandwidth with Lowest Bit Access Energy","2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits)",,,,,,2023,July