"Yoshiaki Uratani,Yu Sekiguchi,Chiaki Sato","Expansion characteristics of thermally expandable microcapsules for dismantlable adhesive under hydrostatic pressure or in resin",,"The Journal of Adhesion","Taylor & Francis","Vol. 93","No. 10","pp. 771-790",2017,Mar.
"Yoshiaki Uratani,Tatsuya Obuchi,CHIAKI SATO","Finite element analysis of stress distribution in cured dismentable adhesive including thermally expandable microcapsules","the international conference on adhesive bonding 2011(AB2011)",,,,,,2011,July
"浦谷佳明,佐藤千明","熱膨張性マイクロカプセル混入接着剤に生じる残留応力の有限要素解析","日本機械学会2010年度年次大会","日本機械学会2010年度年次大会講演論文集",,"Vol. 6",,"pp. 351-352",2010,Sept.
"CHIAKI SATO,Yoshiaki Uratani","DEBONDING PROCESS OF DISMANTABLE ADHESIVE INCLUDING THERMALLY EXPANDABLE MICROCAPSULES","4th World Congress on Adhesion and Related Phenomena(WCARP-?)","4th World Congress on Adhesion and Related Phenomena(WCARP-?) Abstract Booklet",,,,"p. 137",2010,Sept.
"Yoshiaki Uratani,CHIAKI SATO","Stress Distribution in Dismantable Adhesives Including Thermally Expandable Microcapsules","4th International Conference on Advanced Computational Engineering and Experimenting 2010(ACE-X2010)","4th International Conference on Advanced Computational Engineering and Experimenting ABSTRACT BOOK",,,,"pp. 129-130",2010,July