"今井裕太,若林一貴,HEMTHAVYPASOMPHONE,高橋邦夫","水平力を考慮した梁側面凝着モデル","23rd Symposium on “Microjoining and Assembly Technology in Electronics” Mate2017","23rd Symposium on “Microjoining and Assembly Technology in Electronics”",,,,"pp. 387-390",2017,Jan.