"Kazuma Ohashi,Yuka Kobayashi,Hiroyuki Ito,Kenichi Okada,Hideki Hatakeyama,Takuya Aizawa,Tatsuya Ito,Ryozo Yamauchi,Kazuya Masu","A Low Phase Noise LC-VCO with a High-Q Inductor Fabricated by Wafer Level Package Technology","Radio Frequency Integrated Circuits Symposium 2008 (RFIC 2008)","Radio Frequency Integrated Circuits Symposium 2008 (RFIC 2008)",,,,"pp. 123-126",2008,June
"Tomoaki Maekawa,Takahiro Ishii,Junki Seita,Hiroyuki Ito,Kenichi Okada,Hideki Hatakeyama,Y.Uemichi,Tatsuya Ito,Ryozo Yamauchi,Kazuya Masu","A Low-Power Differential Transmission Line Interconnect using Wafer Level Package Technology","IEEE Workshop on Signal Propagation on Interconnects (SPI)","IEEE Workshop on Signal Propagation on Interconnects (SPI)",,,,,2008,May