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"Yi-Lun Yang,Hiroyuki Ito,Kim Youngsuk,Takayuki Ohba,Kuan-Neng Chen","Evaluation of Metal/Polymer Adhesion and Highly Reliable Four-Point Bending Test Using Stealth Dicing Method in 3D Integration",,"IEEE Transactions on Components, Packaging and Manufacturing Technology",,,,,2020,Jan.
"Yi-Lun Yang,Jia-Ling Liu,Guan Wei Chen,Shoichi  Kodama,Kyosuke Kobinata,Kuan-Neng Chen,Hiroyuki Ito,Kim Youngsuk,Takayuki Ohba","Highly Reliable Four-Point Bending Test Using Stealth Dicing Method for Adhesion Evaluation","International Conference on Electronics Packaging",,,,,"pp. 28-31",2019,Apr.