"‰«–{ ‘ñ–ç,ŒäŽè�ô ‘ñ–î,“¡Œ´ ’¼Ž÷,ˆä�ã �®Žq,•½’J ‘ñ�¶,�•�ì �@�‚,‹e’n Œ’•F,�V“c �r”V,“nç³ “~”n,“¡•û �G�¬,–x�ì �„,�¼ŽR �L•F,”ª–Ø ‰pŽ÷","ƒGƒAƒNƒ‰ƒbƒh�\‘¢‚ð—L‚·‚éInP/SiƒnƒCƒuƒŠƒbƒh“±”g˜HŒ^ƒtƒHƒgƒ_ƒCƒI�[ƒh","2024”N“dŽq�î•ñ’Ê�MŠw‰ïƒ\ƒTƒCƒGƒeƒB‘å‰ï",,,,,,2024,Sept.
"Takehiko Kikuchi,Munetaka Kurokawa,Naoki Fujiwara,Naoko Inoue,Takuya Mitarai,Hidenari Fujikata,Takuo Hiratani,Toshiyuki Nitta,Yuhki Itoh,Tohma Watanabe,Chang-Yong Lee,Akira Furuya,Tsuyoshi Horikawa,Nobuhiko Nishiyama,Hideki Yagi","Monolithic integration of various-type III-V epitaxial structures on silicon-photonics platform using chip-on-wafer hydrophilic bonding process","IEEE Silicon Photonics Conference",,,,,,2024,Apr.
"Takuo Hiratani,Naoki Fujiwara,Naoko Inoue,Munetaka Kurokawa,Takehiko Kikuchi,Takuya Mitarai,Toshiyuki Nitta,Tohma Watanabe,Hidenari Fujikata,Nobuhiko Nishiyama,Hideki Yagi","SOA Integrated InP/Si Hybrid Tunable Laser by Utilizing Chip-on-Wafer Hydrophilic Bonding","IEEE Silicon Photonics Conference",,,,,,2024,Apr.
"‹e’n Œ’•F,�•�ì �@�‚,“¡Œ´ ’¼Ž÷,ˆä�ã �®Žq,ŒäŽè�ô ‘ñ–î,“¡•û �G�¬,•½’J ‘ñ�¶,�V“c �r”V,ˆÉ“¡ —FŽ÷,“nç³ “~”n,—› �¹—E,ŒÃ’J �Í,–x�ì �„,�¼ŽR �L•F,”ª–Ø ‰pŽ÷","III-V�¬•Ð/SOIƒEƒFƒn�Ú�‡‚ð—p‚¢‚½SiŒõ‰ñ˜H�ã‚Ö‚ÌŽí�X‚ÌInPŒnƒGƒsƒ^ƒLƒVƒƒƒ‹�\‘¢‚̈ê‘Ì�W�Ï","‘æ71‰ñ‰ž—p•¨—�Šw‰ï�t‹GŠw�p�u‰‰‰ï",,,,,,2024,Mar.
"•½’J ‘ñ�¶,“¡Œ´ ’¼Ž÷,ˆä�ã �®Žq,�•�ì �@�‚,‹e’n Œ’•F,ŒäŽè�ô ‘ñ–î,�V“c �r”V,“nç³ “~”n,“¡•û �G�¬,�¼ŽR �L•F,”ª–Ø ‰pŽ÷","SiƒXƒ‰ƒu“±”g˜H�\‘¢�ã‚ÉInPŒn—˜“¾—̈æ‚ð�Ú�‡‚µ‚½ƒnƒCƒuƒŠƒbƒh”g’·‰Â•ÏƒŒ�[ƒU","“dŽq�î•ñ’Ê�MŠw‰ï‘��‡‘å‰ï",,,,,,2024,Mar.