"T. Shinoda,R. Yasui,W. Woo,K. Fushinobu,T. Tomimura","Influence of two screw fastening distances on contact thermal resistance","ISTP30","Proc. ISTP30",,,"No. ISTP021",,2019,Nov.
"H. Maki,K. Fushinobu,R. Yasui,T. Shinoda","Non-destructive Diagnosis of solder Joint Failure by Means of Thermal Resistance Measurement","ISTP30","Proc. ISTP30",,,"No. ISTP150",,2019,Nov.
"J.V. Thomsen Silveira,Z. Li,K. Fushinobu,R. Yasui,T. Shinoda","Transient thermal response investigation of multiple heat-source electronic systems","ISTP30","Proc. ISTP30",,,"No. ISTP212",,2019,Nov.
"Z. Li,J.V. Thomsen Silveira,K. Fushinobu,R. Yasui,T. Shinoda","Heat dissipation measurement of multiple electronic components on ECU by means of external heater and heat flux sensor","ISTP30","Proc. ISTP30",,,"No. ISTP134",,2019,Nov.
"Takuya Shinoda,安井 竜太,K. Karjadi,KAZUYOSHI FUSHINOBU,富村 寿夫","大きなうねりを有する固体間の接触熱抵抗の測定手法","第56回日本伝熱シンポジウム","第56回日本伝熱シンポジウム講演論文集",,,"No. D111",,2019,May
"Z. Li,J.V. Thomsen Silveira,K. Fushinobu,R. Yasui,T. Shinoda","Heat dissipation measurement of electronic component by means of external heater and heat flux sensor","第56回日本伝熱シンポジウム","第56回日本伝熱シンポジウム講演論文集",,,"No. D112",,2019,May
"J.V. Thomsen Silveira,Z. Li,K. Fushinobu,R. Yasui,T. Shinoda","3D thermal analysis on PCBs with multiple surface mounted semiconductor devices by using an FEM-mased open source PDE solver","第56回日本伝熱シンポジウム","第56回日本伝熱シンポジウム講演論文集",,,"No. D124",,2019,May
"J.V. Thomsen Silveira,Z. Li,B. Yang,R. Yasui,T. Shinoda,K. Fushinobu","Analysis of heat transfer from a heat dissipating device on a substrate","ITherm 2019","Proc. ITherm2019",,,"No. 400",,2019,May